Reduced need for abrasive material and shorter drilling times result in significant savings.
The greater efficiency of the process allows more wells to be drilled in the same amount of time.
Eliminating the need for physical contact between the drill bit and the surface to be drilled reduces the risk of accidents.
Laser drilling is a promising technology to replace traditional mechanical drilling. However, there are still challenges to overcome, such as the low efficiency of the process and the difficulty of control.
The present invention consists of a laser drilling process that uses a fiber optic laser with a tunable wavelength. The wavelength of the laser light is selected according to the material to be drilled, which significantly increases the efficiency of the process. In addition, the system makes it possible to control drilling parameters in real time, such as the intensity and operating regime of the laser, which makes it possible to identify the materials of the drilled surface.
The laser drilling process involves the controlled emission of high-intensity laser beams, directed by optical devices, to penetrate underground formations. Cooling, residue removal and other subsystems ensure optimized performance, overcoming the limitations of conventional mechanical drills.
Patent title:
Laser drilling of underground formations
Deposit Number:
PI 0806638 8
Pontifical Catholic University of Rio de Janeiro – PUC-Rio
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